隨著信息化時(shí)代的來(lái)臨，信息量爆炸式增長(zhǎng)，采用傳統(tǒng)的集成電路處理龐大的數(shù)據(jù)已經(jīng)越發(fā)捉襟見肘。而光子集成回路和光子芯片具有低功耗、高速率、大帶寬等優(yōu)勢(shì)，是未來(lái)光信息處理系統(tǒng)的一種可行方案。光子芯片一般包括片上光源、信號(hào)處理和信號(hào)探測(cè)三個(gè)主要部分。把具有不同材料、不同結(jié)構(gòu)和不同功能的微納光子器件精確、可控地集成在單個(gè)芯片上是實(shí)現(xiàn)光子芯片的關(guān)鍵技術(shù)之一。
With the advent of the information age and the explosive growth of information, the traditional integrated circuit has become more and more difficult to deal with the huge data. The photonic integrated circuit and the photonic chip have the advantages of low power consumption, high speed and large bandwidth, which is a feasible scheme for the future optical information processing system. Photonic chips generally consist of three main parts: on-chip light source, signal processing and signal detection. It is one of the key technologies to realize photonic chip to accurately and controllable integrate micro-nano photonic devices with different materials, structures and functions on a single chip.
近日，北京大學(xué)“極端光學(xué)創(chuàng)新研究團(tuán)隊(duì)”發(fā)展了一種高精度的暗場(chǎng)光學(xué)成像定位技術(shù)（位置不確定度僅21nm），并結(jié)合電子束套刻工藝，實(shí)現(xiàn)了片上量子點(diǎn)微盤激光器與銀納米線表面等離激元波導(dǎo)的精確、并行、無(wú)損集成。這種微盤－銀納米線復(fù)合結(jié)構(gòu)同時(shí)具有介質(zhì)激光器與表面等離激元波導(dǎo)的優(yōu)勢(shì)，因此不僅具有介質(zhì)激光器的低閾值與窄線寬特性，而且具有表面等離激元波導(dǎo)的深亞波長(zhǎng)場(chǎng)束縛特性?；谶@種靈活、可控的制備方法，他們實(shí)現(xiàn)了片上微盤激光器與表面等離激元波導(dǎo)間多種形式的精確可控集成，包括切向集成、徑向集成以及復(fù)雜集成，并且對(duì)量子點(diǎn)無(wú)任何加工損傷；進(jìn)一步，通過(guò)同時(shí)集成多個(gè)片上微盤激光器與多個(gè)銀納米線表面等離激元波導(dǎo)，他們獲得了多模、單色單模以及雙色單模的深亞波長(zhǎng)（0．008λ2）相干輸出光源。
circuits has important applications, and this method can be extended to other materials, and other functions of micro-nano integrated photonic devices, for the future of the photon chip implementation provides a feasible solution.
This work was published on Advanced Materials (Advanced Materials 2018, 30, 1706546) in May 2018, and was highlighted in the form of Frontispiece. The
這些高性能的深亞波長(zhǎng)相干輸出光源可以容易地耦合并分配至其它深亞波長(zhǎng)表面等離激元光子器件和回路中。因此，這種靈活、可控的精確集成方法在高集成密度的光子－表面等離激元復(fù)合光子回路中具有重要應(yīng)用，并且這種方法可以拓展到其它材料和其它功能的微納光子器件集成中，為未來(lái)光子芯片的實(shí)現(xiàn)提供了一種可行的解決方案。
first author of this paper is rong kexiu, a doctoral candidate in the school of physics, Peking University. The research backed by the national natural science foundation, ministry of science and technology, state key laboratory for artificial microstructure and mesoscopic physics, quantum material science collaborative innovation center and extreme optical support collaborative innovation center, etc.
該工作于2018年5月發(fā)表在Advanced Materials上（Advanced Materials 2018， 30， 1706546），并以卷首插畫（Frontispiece）的形式予以重點(diǎn)報(bào)道。文章的第一作者為北京大學(xué)物理學(xué)院博士研究生容科秀，陳建軍研究員為通訊作者。該研究工作得到了國(guó)家自然科學(xué)基金委、科技部、人工微結(jié)構(gòu)和介觀物理國(guó)家重點(diǎn)實(shí)驗(yàn)室、量子物質(zhì)科學(xué)協(xié)同創(chuàng)新中心和極端光學(xué)協(xié)同創(chuàng)新中心等的支持。
processing system. Photonic chips generally consist of three main parts: on-chip light source, signal processing and signal detection. It is one of the key technologies to realize photonic chip to accurately and controllable integrate micro-nano photonic devices with different materials, structures and functions on a single chip.
【此文章原創(chuàng)來(lái)自于158機(jī)床網(wǎng)轉(zhuǎn)載請(qǐng)注明出處】
